1-20 of 24
Keywords: internal stresses
Close
Sort by
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
Published Online: May 8, 2008
... resistance. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins anisotropic conductive adhesive bonding force adhesion strength...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... packaging micromechanical devices optical fibre couplers internal stresses coupled mode analysis optical fibre losses finite element analysis micro-optics The increasing demands for miniaturization, high electrical performance, and high input/output (I/O) pin count have led significant...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... . Manuscript received February 2003; final revision, February 2004. Associate Editor: A. Y-H. Hung. 01 February 2003 01 February 2004 06 10 2004 titanium metallic thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
Published Online: October 6, 2004
... height, the shear forces are decreasing but the bending moments, related to the product of shear force and stand-off height, can still increase. flip-chip devices thermomechanical treatment bending internal stresses thermal stresses integrated circuit packaging Flip chip packaging...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
Published Online: May 4, 2004
.... 03 09 2003 04 05 2004 fracture toughness testing integrated circuit packaging internal stresses finite element analysis fracture mechanics microassembling Integrated circuit packaging has been continuously driven to miniaturization. After circuits are built on the front...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
Published Online: April 30, 2004
...; final revision, November 2003. Associate Editor: B. Courtois. 01 April 2003 01 November 2003 30 04 2004 glass ceramics microcracks thermal shock bending fracture internal stresses thermal analysis laser beam applications High quality separation of nonmetallic...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
..., the two failure mechanisms can be interrelated, especially when interface cracking is in close proximity to the solder connections. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses 01 March 2003 01 November 2003 30...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
Published Online: December 15, 2003
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2001. Associate Editor: L. Ernst. 01 November 2001 15 12 2003 internal stresses ceramic capacitors reliability finite element analysis...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... for each constituent are taken into account in the modeling. integrated circuit packaging moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity McSkimin , H. J. , and Andreatch , P. , 1964 , “ Elastic Moduli of Silicon vs...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
... packaging metallisation thermal conductivity finite element analysis stress analysis thermal expansion substrates modelling internal stresses Semiconductor laser diodes are the primary components of various optoelectronic applications. Unlike the ordinary semiconductors, a laser...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 400–413.
Published Online: September 17, 2003
... and fracture (using the J integral and stress intensity factors) at the bi-material interface (between two layers) in such a strip. internal stresses fracture encapsulation flip-chip devices packaging delamination 01 Sep 2002 17 09 2003 2003 ASME ...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
... thermal expansion internal stresses The foundation of microelectromechanical systems (MEMS) is the capability of creating controllable and movable mechanical structures using integrated circuit (IC) processing technology. MEMS technology has developed gradually over the last five decades...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
Published Online: December 12, 2002
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
Published Online: July 26, 2002
.... Associate Editor: S. M. Heinrich. 19 October 2000 26 07 2002 polymer films stress relaxation viscoelasticity bending internal stresses plastic packaging Damage Accumulation Residual Stress Relaxation Threshold Activation Energy Elastic Potential Polymer Film Radius...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
... on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile, creep...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 115–121.
Published Online: May 2, 2002
... extracted at various wafer sites so that both normal and shear stress on the test chips can be measured. Finally, we packaged the test chips into 100-pin PQFP structures with different batches and measured internal stresses on the test chips inside the packaging. After measuring packaging induced stresses...