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Keywords: interfacial stresses
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031005.
Published Online: July 30, 2008
... and calculating their effective material properties by employing the Mori–Tanaka method. As the worst-case scenario, direct silicon die attach with solder bumps was assumed to analyze the interfacial stresses, which were predicted in trend by a simplified multilayered stack model and calculated in detail...
