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Keywords: interfacial reaction
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Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

Ousama M. Abdelhadi, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021004.
Paper No: EP-12-1069
https://doi.org/10.1115/1.4023846
Published Online: March 28, 2013
...: Jianmin Qu. 11 07 2012 19 02 2013 The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cu-substrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at multiple levels...
View Articletitled, Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
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Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds
Journal Articles

Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints

Hao Lu, Chun Yu, Peilin Li, Junmei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
https://doi.org/10.1115/1.2957322
Published Online: August 1, 2008
...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...
View Articletitled, Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
Open the PDF for Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints in another window
Topics: Current density, Electrodiffusion, Finite element analysis, Lead-free solders, Solder joints, Solders, Tin