... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...

... the temperature range used in the measurements. Saturated concentrations as a function of RH 25 12 2006 21 08 2007 31 01 2008 electronics packaging humidity integrated circuits Moisture-related failure issues have become increasingly important as a demand...

...Hiroyuki Tsuritani; Toshihiko Sayama; Kentaro Uesugi; Takeshi Takayanagi; Takao Mori In high-density packaging technology, one of the most important issues is the reliability of the microjoints connecting large scale integrated circuit chips to printed circuit boards electrically and mechanically...

... that can be observed. Classical continuum mechanics theories fail to describe these phenomena, and higher-order multiscale theories are required to arrive at an appropriate prediction of the mechanical behavior of miniaturized structures. 03 02 2003 24 06 2004 integrated circuits...