... 09 2011 30 09 2011 cooling electronics packaging integrated circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1...

... 2011 26 09 2011 26 09 2011 embedded systems hybrid integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits...

... integrated circuit interconnections numerical analysis printed circuits solders halogen free lead free solder alloy intermetallic characteristics joint strength The environmentally friendly green product is an irreversible trend for electronic industries, following the shift toward Pb...

.../1.1669118 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive...

... in package geometries. integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging industry primarily relies on the tried and trusted technique of imposing...

... moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding flip chip bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics Research interest...

... vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations 29 10 2007 05 12 2008 25 02 2009 Local 2D model for resistor component L C R component on the FEA...

... simulations. A general fatigue life prediction methodology is next described in detail. Finally, this methodology is tested and verified against the empirical data. ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections...

... finite element analysis high-speed techniques image sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...

..., the interconnect behavior is a key issue in the long-term performance of the whole system. interconnect interface interferometer micropolar theory ball grid arrays integrated circuit interconnections stress-strain relations thermal analysis 16 02 2007 07 09 2007 15 05 2008...

.... The approach along with the numerical procedures developed for the investigation can be a practical tool for realizing better device reliability and thus high manufacturing yield. 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...

... of others. 10 07 2007 15 08 2007 12 02 2008 e-mail: amip.shah@hp.com ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections References Intel® Stacked Chip Scale...

... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...

... thermal cycles (e.g., 2000 cycles with no failure or 2500 cycles with less than 1% failure rate). automotive electronics ball grid arrays chip scale packaging integrated circuit interconnections integrated circuit reliability printed circuits 29 12 2004 07 03...

... . flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling...

... 03 06 2005 silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance...