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Keywords: integrated circuit design
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Journal Articles
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... 19 03 2010 19 03 2010 integrated circuit design integrated circuit packaging integrated circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book...
Journal Articles
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
..., and the population of vias. 18 09 2008 03 06 2008 14 11 2008 ball grid arrays copper heat conduction integrated circuit design integrated circuit packaging laminates printed circuits resins thermal management (packaging) printed circuit board heat conduction analytical modeling...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 59–66.
Published Online: March 21, 2005
... circuits integrated circuit packaging integrated circuit design thermal analysis circuit optimisation electronic engineering computing Integrated Design Optimization Integrated Power Electronic Module Thermal Analysis While thermal management is a key enabling technology for the next...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
Published Online: June 10, 2003
... packaging Taguchi methods moulding circuit CAD integrated circuit design TSOP II LOC Package Taguchi Method Mold-Flow Balance In LOC (lead on chip) packaging, inner leads of the leadframe are arranged right above the chip rather than surrounding the chip. The process of LOC packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 58–63.
Published Online: October 29, 1999
... circuit design fracture mechanics thermal stress cracking finite element analysis integrated circuit reliability design of experiments Ball Grid Array (BGA) Crack Die Finite Element Analysis (FEA) Flip-Chip Fracture Mechanics Design Methodology Design of Experiment (DOE) Time...