... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... flip-chip devices integrated circuit interconnections encapsulation integrated circuit packaging plastic packaging shear strength heat treatment interface structure reflow soldering surface chemistry As the trend in requirements of electronic packaging is toward higher I/O, greater...

... 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability of flip chip on board (FCOB) samples is greatly increased by the introduction...

... is large (Finot et al. 4 ). flip-chip devices chip-on-board packaging plastic packaging curvature measurement measurement by laser beam finite element analysis thermal expansion bending heat treatment 10 September 1999 21 March 2000 Contributed by the Electrical...