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Keywords: heat transfer enhancement
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Journal Articles

An Experimental Study on Heat Transfer Enhancement of Non-Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions

Di Zhang, Lu Zheng, Gongnan Xie, Yonghui Xie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021005.
Paper No: EP-13-1079
https://doi.org/10.1115/1.4025713
Published Online: April 29, 2014
... online April 29, 2014. Assoc. Editor: Gary Miller. 29 07 2013 10 10 2013 Dimple and protrusion play important roles in the heat transfer enhancement and flow characteristic in cooling channels, which widely employed within electronic cooling systems. Non-Newtonian fluid has...
View Article titled, An Experimental Study on <span class="search-highlight">Heat</span> <span class="search-highlight">Transfer</span> <span class="search-highlight">Enhancement</span> of Non-Newtonian Fluid in a Rectangular Channel With Dimples&#x2F;Protrusions
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Topics: Flow (Dynamics), Fluids, Heat transfer, Non-Newtonian fluids, Viscosity, Friction, Shear (Mechanics)
Journal Articles

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Peipei Li, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
https://doi.org/10.1115/1.4005297
Published Online: December 9, 2011
... 24 05 2011 16 09 2011 09 12 2011 09 12 2011 cooling forced convection liquid metals thermal management (packaging) thermal resistance liquid metal thermosyphon effect thermal management chip cooling LED self support heat driven heat transfer enhancement...
View Article titled, Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
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Topics: Convection, Cooling, Heat, Liquid metals, Temperature, Thermal resistance, Water, Stress, Coolants, Computer cooling
Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
https://doi.org/10.1115/1.4002012
Published Online: September 9, 2010
.... , 2009 , “ On-Chip Cooling by Superlattice-Based Thin-Film Thermoelectrics ,” Nat. Nanotechnol. 1748-3387 , 4 , pp. 235 – 238 . 10.1038/nnano.2008.417 Nguyen , C. T. , Roy , G. , Gauthier , C. , and Galanis , N. , 2007 , “ Heat Transfer Enhancement Using Al2O3-Water...
View Article titled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes
Journal Articles

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
https://doi.org/10.1115/1.2429711
Published Online: March 2, 2006
... for macroscale channels, can also be used to enhance heat transfer inside microchannels. laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Heat transfer inside flow passages can be enhanced by using passive surface modifications...
View Article titled, Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
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Topics: Flow (Dynamics), Heat transfer, Laminar flow, Microchannels, Microscale devices, Computer simulation