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Keywords: heat sinks
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... be strongly enhanced by subsequent work hardening in mild cycling. e-mail:  sthekku1@binghamton.edu 12 04 2021 30 06 2021 15 09 2021 microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
... power electronics, and space systems. This paper addresses (a) the implementation of two-phase microchannel heat sinks in these applications, (b) the fluid physics and limitations of boiling in small passages, and effective tools for predicting the thermal performance of heat sinks, and (c) means...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
...Christopher T. DeGroot; Derek Gateman; Anthony G. Straatman A numerical study on the effect of thermal contact resistance and its impact on the performance of finned aluminum foam heat sinks has been conducted. Calculations are based on the solution of the volume-averaged mass, momentum, and energy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
...Pablo D. Quinones; Lawrence S. Mok A cooling device using stacked centrifugal fans and circular heat sinks was designed for cooling a semiconductor chip with a heat flux near 125 W / cm 2 . In this device, heat is conducted from the chip to a copper heat distribution block and then distributed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
Published Online: July 2, 2009
...Jaeseon Lee; Issam Mudawar This study examines the pressure drop characteristics of subcooled two-phase microchannel heat sinks. A new model is proposed, which depicts the subcooled flow as consisting of a homogeneous two-phase flow layer near the heated walls of the microchannel and a second...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
Published Online: June 23, 2009
... areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
Published Online: April 3, 2009
...Mustapha Faraji; Hamid El Qarnia The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
...Craig Green; Andrei G. Fedorov; Yogendra K. Joshi An innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented. The heat sink design utilizes two separate unmixed fluids to meet the cooling...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
...Afzal Husain; Kwang-Yong Kim A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
...Christopher T. DeGroot; Anthony G. Straatman; Lee J. Betchen A numerical study has been undertaken to explore the details of forced convection heat transfer in finned aluminum foam heat sinks. Calculations are made using a finite-volume computational fluid dynamics (CFD) code that solves...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011004.
Published Online: February 11, 2009
... between a spreader and heat source is less than 0.2. Even so, the thermal resistance corresponding to the predicted thickness is still in good agreement with the analytical solution. The proposed approximation will be useful for practical thermal design of heat sinks by predetermining the spreader...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041002.
Published Online: November 14, 2008
...Karl J. L. Geisler; Avram Bar-Cohen A finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit dependence of fin spacing on boiling heat transfer coefficients...
Journal Articles
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041108.
Published Online: November 14, 2008
...Wataru Nakayama This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2008, 130(3): 034501.
Published Online: August 8, 2008
...Z. Q. Lou; C. Yap; A. S. Mujumdar Impinging jet heat transfer is a promising method to cool electronic components. In this paper, a numerical study has been carried out to examine the conjugate heat transfer under a confined impinging jet using a plate-fin heat sink as the target plate. Effects...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031010.
Published Online: August 1, 2008
...W. A. Khan; J. R. Culham; M. M. Yovanovich An entropy generation minimization method is applied to study the thermodynamic losses caused by heat transfer and pressure drop for the fluid in a cylindrical pin-fin heat sink and bypass flow regions. A general expression for the entropy generation rate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
... management more challenging, but IPEMs also offer the opportunity to extract heat from both the top and the bottom side of the module, enabling double-sided cooling. Although double-sided cooling of IPEMs can be implemented using traditional aluminum heat sinks, microchannels offer much higher heat transfer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
Published Online: April 25, 2008
...K. Lafdi; O. Mesalhy; A. Elgafy In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties...