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Keywords: heat driven
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
... for Heat Dissipation of High Power Density Microdevices ,” Heat Mass Transfer , 46 , pp. 1327 – 1334 . 10.1007/s00231-010-0658-7 11 Ma , K. Q. , and Liu , J. , 2007 , “ Heat-Driven Liquid Metal Cooling Device for the Thermal Management of a Computer Chip ,” J. Phys. D: Appl. Phys...
