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Keywords: fracture toughness testing
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
... circuit interconnections integrated circuit reliability adhesion fracture toughness testing adhesive bonding ageing scanning electron microscopy integrated circuit packaging substrates Anisotropic Conductive Adhesive (ACA) Moisture Effect Peel Strength During the past few years...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... semiconductors semiconductor-metal boundaries fracture toughness testing Knowledge of the mode mix dependent interfacial fracture toughness (Γ) is necessary to predict if delamination will occur. However, measuring Γ is a challenge for thin film interfaces. Typical testing methods such as bimaterial...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
Published Online: May 4, 2004
.... 03 09 2003 04 05 2004 fracture toughness testing integrated circuit packaging internal stresses finite element analysis fracture mechanics microassembling Integrated circuit packaging has been continuously driven to miniaturization. After circuits are built on the front...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
Published Online: March 14, 2003
... moisture fracture toughness testing encapsulation masks adhesion integrated circuit packaging failure analysis finite element analysis A significant problem in the microelectronic packaging industry is the presence of moisture induced failure mechanisms. Moisture is a multi-dimensional...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
Published Online: December 12, 2002
..., December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 fracture toughness testing notch strength encapsulation plastic packaging integrated circuit packaging finite element analysis filled...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 147–151.
Published Online: September 15, 1999
.... Associate Technical Editor: G. De Mey. 26 Jan 1999 15 Sept 1999 fracture toughness testing copper adhesives fracture mechanics finite element analysis Adhesives are widely used in various industrial applications to reduce weight and costs, and to increase reliability. One...