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Keywords: forming processes
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 22–25.
Published Online: April 30, 2004
...Li Ming Yu; Bang Han Sur; Kim Young Pyo; Wang Chun Qing; Zhang Lei Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate...
