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Keywords: flow visualisation
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Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
... for base camera signal and AOM 13 11 2009 24 04 2010 09 09 2010 curing flow visualisation holography microfluidics nanolithography particle track visualisation resins soft lithography ultraviolet lithography ultraviolet radiation effects velocimeters Figure 1...
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Open the PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV in another window
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
... is the pipe nozzle exit diameter, and k a is the thermal conductivity of air that is exiting the nozzle. 28 11 2004 30 10 2006 cooling flow separation flow visualisation jets nozzles thermal management (packaging) The present investigation considers surface...
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 240–246.
https://doi.org/10.1115/1.1289761
Published Online: February 15, 2000
.... 03 August 1998 15 February 2000 heat sinks integrated circuit packaging cooling thermal resistance flow visualisation integrated circuit modelling The word “rightsizing” in reference to electronic machines such as computers implies increasing demand for compact structures...
View Article titled, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
Open the PDF for Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages in another window
Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization