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Keywords: flow visualisation
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Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
DOI: https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
... with the theoretically calculated displacement values obtained from UV irradiation flux. Moreover, the displacement during photo-curing appeared to be proportional to the increase in temperature. 13 11 2009 24 04 2010 09 09 2010 curing flow visualisation holography microfluidics...
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Click here to open pdf in another window PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
DOI: https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
... cooling flow separation flow visualisation jets nozzles thermal management (packaging) The present investigation considers surface Nusselt number distributions and flow structure on and around primary and secondary pedestals mounted on a flat test plate used to model a heat sink. Results...
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
Click here to open pdf in another window PDF for Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, H. Matsushima, T. Komatsu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 240–246.
DOI: https://doi.org/10.1115/1.1289761
Published Online: February 15, 2000
... simulation of the three-dimensional flow and temperature field for square pin fins (256 pins) was performed by Sathe et al. 3 . heat sinks integrated circuit packaging cooling thermal resistance flow visualisation integrated circuit modelling 03 August 1998 15 February 2000...
View Article titled, Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
Click here to open pdf in another window PDF for Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization