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Keywords: flow separation
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
... 25 01 2007 flow separation heat transfer jets multichip modules nozzles quadratic programming response surface methodology sensitivity analysis thermal management (packaging) multichip module unconfined round-jet impingement Nusselt number Grashof number jet Reynolds number...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
Published Online: October 30, 2006
... measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
Published Online: June 3, 2005
... convection flow separation cooling Continued miniaturization of integrated chips is a consequence of recent developments in semiconductor technology and integrated circuit manufacturing methods. As a result, electronic components are packaged to operate at heat flux generation levels and power...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
Published Online: June 10, 2003
.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The concept of the capillary pumped loop (CPL) first appeared thirty years ago during the initial...