... they are stiffer than solder. Therefore, the all-copper-connection was selected in this work to investigate the modeling aspects and simplifications in high density flip-chip connections. finite element analysis flip-chip devices optimisation 28 05 2010 24 08 2011 09 12 2011 09 12...

..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...

... inspection by a synchrotron radiation X-ray microtomography system. 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability...

..., underfill material properties are crucial to package reliability performance ( 1 2 ). amine-based phenolic-based reliability underfill adhesion ball grid arrays flip-chip devices fracture toughness testing plastic packaging reliability thermal expansion Young's modulus 06 08...

... 0.002305 0.002256 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder wetting...

..., and the rising and delay time affects the bonding quality due to the temperature of the tool head. 03 03 2009 19 09 2010 24 11 2010 24 11 2010 bonding processes electronics packaging flip-chip devices light emitting diodes principal component analysis Taguchi methods Among...

... flip-chip devices integrated circuit bonding silver joints flip-chip direct bonding solid-state bonding process electronic packaging integrated circuits Figure 1 displays the solid-state bonding structure. In this design, 6 × 6   mm 2 Si chips are diced from 50 mm...

... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys...

... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 ball grid arrays delamination finite element analysis flip-chip devices integrated circuit reliability shrinkage...

...://www.electrooptics.com/ Moaveni , S. , 1999 , Finite Element Analysis: Theory and Application With ANSYS , Prentice Hall , Englewood Cliffs, NJ . 28 09 2008 11 07 2009 21 10 2009 data communication electronics packaging flip-chip devices light emitting diodes optical fibre...

...-chip devices lead mass spectroscopic chemical analysis solders tin flip chip fine pitch high I/O density no-flow underfill void formation gas chromatography-mass spectrum chemical reaction Increasing demand for high performance devices initiated the development of flip chip...

... bonding processes flip-chip devices interconnections reliability thermal analysis flip chip package capillary-flow underfill no-flow underfill assembly process warpage reliability The semiconductor package trend has an increased need for flip chip (F/C) package toward demands...

... 27 03 2009 copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier...

... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...

... 2008 delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... electromigration is responsible for metallization failures that lead to an excessive increase in the resistance of the solder joints. electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu weight content copper alloys electromigration flip-chip devices gold nickel reliability...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

..., and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and transient out-of-plane displacement measurements for a 6.35 × 6.35 × 0.6 mm 3 PB18 flip chip mounted on a FR4 board. 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection...