... to a reference chip scale package (CSP). The comparison is performed using finite element simulation. A combined measurement-simulation technique is used to calibrate the finite element simulations on a reference object. The adjustment is based on the in-plane deformation field obtained by both simulation...

... and parameters were discussed. thermosonic wire bonding wire looping process material properties capillary parameters capillary trace finite element simulation Wire-bonding is a traditional interconnect method can be widely used in modern three-dimensional (3D) packages due to its existing...

... observed and discussed. In addition, the final comparisons between the experimental data and the finite element simulations show good consistency. Tummala , R. R. , Rymaszewski , E. J. , and Klopfenstein , A. G. , 1997 , Microelectronics Packaging Handbook , 2nd ed. , Chapman...

... analysis J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation Flip chip on broad (FCOB) is being increasingly used for a wide range of applications such as computers, portable electronics and automotive application. The FCOB provides shorter...