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Keywords: finite difference methods
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
Published Online: March 4, 2010
... a complex molding compound flow behavior with multiple microchips in a single cavity. The developed numerical algorithm is based on the finite difference method combined with the robustness of volume of fluid volume-tracking method to solve the two-phase flow field in complex mold and die geometries. Twelve...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 314–323.
Published Online: November 24, 2004
... stresses thermal management (packaging) finite difference methods linear differential equations finite element analysis Trilayer assemblies are commonly found in solder, brazed and adhesive joints, as well as in laminates created by fusing different materials together. If such structures...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
Published Online: May 2, 2002
... Printed Wiring Board Laminated Plate printed circuits elastic deformation laminates modal analysis stress analysis finite difference methods 30 May 2000 02 05 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC...
