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Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang

Publisher: ASME

J. Electron. Packag. December 2007, 129(4): 469–472.

https://doi.org/10.1115/1.2804097

Published Online: April 4, 2007

... to avoid signal propagation delay ( 8 ). thermal conductivity polymer composite ceramic filler dielectric properties ceramics conducting polymers crushing dielectric losses electronics packaging encapsulation filled polymers particle size permittivity sieving silicon compounds...

View Article titled, High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites

Journal Articles

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 386–391.

https://doi.org/10.1115/1.1602703

Published Online: September 17, 2003

... PACKAGING . Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung. 01 Sep 2001 01 March 2002 17 09 2003 thermal conductivity contact resistance filled polymers shear modulus percolation Particle-laden polymeric thermal interface...

View Article titled, Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Topics: Contact resistance, Particulate matter, Thermal conductivity, Percolation theory, Stiffness, Modeling, Polymers, Fillers (Materials)

Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 93–97.

https://doi.org/10.1115/1.1534842

Published Online: March 14, 2003

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 14 03 2003 surface mount technology printed circuit accessories printed circuit testing adhesives impact testing impact strength filled polymers conducting polymers shear...

View Article titled, Impact Resistance of SM Joints Formed With ICA

Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys

Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya

Publisher: ASME

J. Electron. Packag. December 2002, 124(4): 323–327.

https://doi.org/10.1115/1.1501304

Published Online: December 12, 2002

... Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 fracture toughness testing notch strength encapsulation plastic packaging integrated circuit packaging finite element analysis filled polymers reflow soldering delamination particle reinforced composites...

View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination

Journal Articles

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 188–191.

https://doi.org/10.1115/1.1477191

Published Online: July 26, 2002

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...

View Article titled, Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Topics: Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water

Journal Articles

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Johan Liu, Zonghe Lai

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 240–245.

https://doi.org/10.1115/1.1478059

Published Online: July 26, 2002

... with ultra-fine pitch technology. flip-chip devices adhesives fine-pitch technology conducting polymers circuit reliability environmental testing contact resistance electric resistance measurement filled polymers 27 July 1999 26 07 2002 Contributed by the Electronic...

View Article titled, Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Topics: Adhesive joints, Adhesives, Contact resistance, Cycles, Failure, Flip-chip, Reliability, Temperature, Testing, Electrical resistance

Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director

Publisher: ASME

J. Electron. Packag. March 2002, 124(1): 1–6.

https://doi.org/10.1115/1.1400751

Published Online: January 12, 2001

... manuscript received January 12, 2001. Associate Editor: G. De Mey. 29 June 1999 12 January 2001 filled polymers nanostructured materials capacitors multichip modules materials preparation electron device manufacture Passive components such as resistors, capacitors...

View Article titled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter

Journal Articles

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, Member ASME, E. Suhir, Fellow ASME, G. W. Kammlott

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 260–267.

https://doi.org/10.1115/1.1349422

Published Online: January 11, 2000

... design of, plastic packages. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD January 11, 2000. 11 January 2000 silicon compounds filled polymers moulding thermal stresses...

View Article titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Molding, Particulate matter, Thermal expansion, Elastic moduli, Thermal stresses, Shear modulus

Journal Articles

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

M. Uschitsky, E. Suhir

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 47–51.

https://doi.org/10.1115/1.1325009

Published Online: September 2, 1998

.... 7 , Cai and Weitsman 5 ). plastic packaging integrated circuit packaging integrated circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength 26 July 2000 02 September 1998...

View Article titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Fillers (Materials), Mechanical properties, Molding, Particulate matter, Sorption, Indium compounds, Stress

Journal citation

NARROW

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Impact Resistance of SM Joints Formed With ICA

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Reliability of Anisotropically Conductive Adhesive Joints on a Flip-Chip/FR-4 Substrate

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

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