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Keywords: epoxy molding compound
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Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011009.
Paper No: EP-18-1065
https://doi.org/10.1115/1.4047475
Published Online: June 26, 2020
...Ruifeng Li; Daoguo Yang; Ping Zhang; Fanfan Niu; Miao Cai; G. Q. Zhang This article describes research on changes of glass transition temperature of electron encapsulated polymer-epoxy molding compound (EMC) after thermal oxidation under high-temperature air storage conditions. The evolutions...
View Article titled, Effects of High-Temperature Storage on the Glass Transition Temperature of <span class="search-highlight">Epoxy</span> <span class="search-highlight">Molding</span> <span class="search-highlight">Compound</span>
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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011010.
https://doi.org/10.1115/1.3068321
Published Online: February 13, 2009
... percentage. 22 12 2007 26 09 2008 13 02 2009 electronics packaging finite element analysis shrinkage silicon compounds epoxy molding compound FEA bimaterial model thermal expansion coefficient chemical cure shrinkage silica filler percentage Owing to its low cost...
View Article titled, Characterization of Chemical Cure Shrinkage of <span class="search-highlight">Epoxy</span> <span class="search-highlight">Molding</span> <span class="search-highlight">Compound</span> With Application to Warpage Analysis
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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)