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Keywords: environmental degradation
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Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
Published Online: July 8, 2004
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003. Associate Editor: G.-Q. Lu. 01 July 2003 08 07 2004 packaging design for environment environmental degradation dielectric losses...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 470–474.
Published Online: December 15, 2003
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received May 2001; final revision, June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 microsensors pressure sensors humidity environmental degradation finite element analysis...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 184–187.
Published Online: July 26, 2002
...-on-board packaging reflow soldering swelling environmental degradation viscoplasticity life testing finite element analysis ageing thermal stress cracking integrated circuit interconnections The direct attachment of a flip chip die to an organic substrate with eutectic (63Sn/37Pb) solder...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
Published Online: May 2, 2002
..., 2001. Associate Editor: J. Lau. 12 July 2000 24 April 2001 02 05 2002 integrated circuit packaging moisture environmental degradation adhesion delamination fracture toughness encapsulation soldering masks Of particular interest in reliability studies...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
Published Online: January 1, 2000
... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...