1-5 of 5
Keywords: electronic engineering computing
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
Published Online: November 17, 2008
... from 3D DIC are compared with the accelerations recorded by the accelerometers mounted on board. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 356–365.
Published Online: November 13, 2006
... 10.1016/S0168-874X(03)00115-X , 40 , pp. 793 – 805 . Desai , C. S. , 2000 , DSC-SST2D , Computer Code for Static, Dynamic, Creep and Thermal Analysis: Solid, Structure and Soil-Structure Problems, Parts I to II, Tucson, AZ. 05 09 2006 13 11 2006 electronic engineering...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 59–66.
Published Online: March 21, 2005
... circuits integrated circuit packaging integrated circuit design thermal analysis circuit optimisation electronic engineering computing Integrated Design Optimization Integrated Power Electronic Module Thermal Analysis While thermal management is a key enabling technology for the next...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
Published Online: March 14, 2003
... collisions and improper ram speed. If the deformation of wire is too large, it can cause a short circuit (due to touching of adjacent wires) or open circuit (due to wire breakage). integrated circuit packaging encapsulation drag moulding wires (electric) electronic engineering computing...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 98–103.
Published Online: March 14, 2003
... reliability stress analysis finite element analysis eigenvalues and eigenfunctions electronic engineering computing In order to meet the challenges of further miniaturization in electronic device packaging, a novel chip thinning technology has been developed in recent years 1 . This type...