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Keywords: electronic devices
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021001.
Paper No: EP-13-1044
Published Online: April 29, 2014
... microchannels. MEMS water cooling microchannel groove dimple electronic devices With the rapid development of MEMS technology, effective microchannel heat sinks are drawing more and more attention as an advanced cooling technology. Investigating the potential of microchannel heat sinks...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021004.
Published Online: April 25, 2008
...K. Lafdi; O. Mesalhy; A. Elgafy In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties...
