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Keywords: elastic-plastic properties
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Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
https://doi.org/10.1115/1.2957330
Published Online: July 30, 2008
...Hironori Tohmyoh; Kiichiro Yamanobe; Masumi Saka; Jiro Utsunomiya; Takeshi Nakamura; Yoshikatsu Nakano This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins...
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Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction