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Keywords: drop-in heat spreader
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
Published Online: September 12, 2006
...Tong Hong Wang; Yi-Shao Lai Due to cost and process considerations, sometimes a drop-in heat spreader is incorporated in a quad flat package, which is not attached to the die pad. Consequently, due to mismatch of thermal expansions of the components, gapping is inevitable on the unattached...
