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Keywords: drop impact
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Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
Published Online: March 15, 2007
...Fang Liu; Guang Meng; Mei Zhao Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... for drop impact and designing for temperature cycling. The well-known design rules for temperature cycling—minimizing package length and maximizing interconnection standoff—does not work for drop impact. Instead, drop impact reliability can be enhanced by increasing the interconnection diameter, reducing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
...E. H. Wong The dynamic response of the printed circuit board (PCB) in a standard board-level drop impact test has been modeled as a spring-mass system, a beam, and a plate. Analytical solutions for the time-response and amplification of the deflection, bending moment, and acceleration at any point...