Skip Nav Destination
1-1 of 1
Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... structures, as well as by dislocation networks formed in sintering or under cyclic loading. Creep rates of sintered nanocopper structures were found to be dominated by the diffusion of individual atoms or vacancies, while dislocation motion remained negligible up to stresses far above those of practical...