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Keywords: copper pillars interconnection
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021008.
Paper No: EP-24-1086
Published Online: February 4, 2025
... copper pillar interconnection technique that can be implemented at room temperature and atmospheric pressure. comsol simulation results show that under convective conditions, the plating layer primarily deposits on the convection exit side of the copper plate. Under weak convection and low current...
