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Keywords: copper nanoparticles
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Journal Articles
Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... be strongly enhanced by subsequent work hardening in mild cycling. e-mail: sthekku1@binghamton.edu 12 04 2021 30 06 2021 15 09 2021 microjoints heat sinks copper nanoparticles rapid sintering porosity particle size macroscopic strain inelastic deformation impression creep...
