...Zhenyu She; Vijay K. Dhir Saturated water at one-atmosphere pressure was boiled on horizontal flat copper disks of diameters 1.0, 1.5, and 2.0 cm, respectively. The contact angle was varied from about 10 to 80 deg by controlling thermal oxidation of the disks, while the surrounding vessel size...

...,   0.12 mm,   0.16 mm; and side-edge length, c = 0.2 mm. At the operating temperature of 25  ° C, the experimental test fluid is a Newtonian fluid with n = 1 , surface tension of σ = 0.064 N/m, dynamic viscosity of μ = 1.5 Pa·s, and static contact angle...

... roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. Dimensional contact angle versus dimensionless time for varying values of n The substrate surface roughness had a significant effect...

... grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle...