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Keywords: cohesive zone modelClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031004.
Published Online: September 14, 2011
... impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop...