1-20 of 44
Keywords: chip scale packaging
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021007.
Published Online: June 25, 2010
... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041004.
Published Online: October 21, 2009
...Jose Omar S. Amistoso; Alberto V. Amorsolo, Jr. Cold bump pull tests performed on wafer level chip scale packages using SAC105 solder bumps show an increase in the occurrence of brittle failure modes with aging temperature and time. Fast intermetallic growth at 0–1000 h can be attributed to ( Cu...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
... a 10,000 g shock of any duration in any direction without exceeding the Cirlex tensile stress of 229 MPa. 31 07 2008 03 06 2009 21 10 2009 atomic clocks chip scale packaging clocks displacement measurement finite element analysis surface emitting lasers temperature control...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021006.
Published Online: April 1, 2009
... is Key to Productivity and Profitability ,” SMT Magazine , January , pp. 40 – 42 . 13 01 2008 05 11 2008 01 04 2009 ball grid arrays chip scale packaging plastic packaging Over the past several decades, electronic packaging technology has been evolving rapidly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
Published Online: February 13, 2009
... simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given. 06 11 2007 26 09 2008 13 02 2009 capacitance measurement ceramic capacitors chip scale packaging crack detection failure analysis finite element...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance. 27 12 2007 07 08 2008 12 02 2009 chip scale packaging finite element analysis high-speed techniques image...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
.... The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested. 29 12 2004 07 03 2007 automotive electronics ball grid arrays chip scale...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
Published Online: February 23, 2006
... such as ball grid array (BGA) and chip-scale package (CSP) assemblies are being used in double-sided configurations for network and memory device applications as they reduce the routing space and improve electrical performance ( Shiah, A. C., and Zhou, X., 2002, “A Low Cost Reliability Assessment for Double...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
Published Online: May 18, 2005
... possible configurations for the solution presented. 29 07 2004 18 05 2005 heat sinks thermal management (packaging) chip scale packaging heat conduction thermal conductivity microprocessor chips Thermal management of electronic packages and systems is one of the key technical...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
Published Online: March 21, 2005
... with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications. Manuscript received January 6, 2004; revision received June 8, 2004. Review conducted by: Y...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 29–32.
Published Online: March 21, 2005
... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...