... micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices. pin-fin microchannel varying high heat flux chip cooling infrared Breakthroughs in many of today's technologies are becoming increasingly...

.... , 2006 , “ Water-and-Dust Proof Structure for a Notebook Computer Heat Sink ,” U.S. Patent No. 0,262,507 A1. 8 Liu , J. , and Zhou , Y. X. , 2002 , “ A Computer Chip Cooling Method Which Uses Low Melting Point Metal and Its Alloys as the Cooling Fluid ,” China Patent No. 021314195...

.... , 2009 , “ On-Chip Cooling by Superlattice-Based Thin-Film Thermoelectrics ,” Nat. Nanotechnol. 1748-3387 , 4 , pp. 235 – 238 . 10.1038/nnano.2008.417 Nguyen , C. T. , Roy , G. , Gauthier , C. , and Galanis , N. , 2007 , “ Heat Transfer Enhancement Using Al2O3-Water...

... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...

..., specific surface area, thermal conductivity, and surface wetability of the working fluid. vapor chamber graphite foam heat spreader chip cooling cooling integrated circuit packaging thermal conductivity thermal resistance graphite 30 09 2005 15 11 2005 2006...

... trajectories of the obstruction block on chip cooling were investigated. A numerical algorithm PISO , a conjugate heat transfer scheme for fluid-solid thermal interactions with moving grids was used to solve a coupled system of governing equations. The study shows that the induced trajectories...