...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...

... interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always. 06 02 2007 02 04 2008 17 11 2008 ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections...

..., 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress...

... of the package assembly consists of a high melting point solder ball (90%Pb/10%Sn) and a eutectic solder fillet (63%Pb/37%Sn). The high melting point solder ball does not reflow during assembly process, which provides a consistent and reproducible standoff between the ceramic package and the PCB. 1...

... January 2003 01 November 2003 30 04 2004 multichip modules ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...

... into consideration, we explore three ceramic packaging technologies, namely high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate...

...] Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Yi-Hsin Pao. ceramic packaging ball grid arrays creep finite element analysis reliability fatigue soldering The demands for higher input...

... packages on either FR-4 or polyimide printed circuit boards (PWB) with six layers, 0.062 inch thick. Ceramic packages with 625 I/Os were one of the type of BGAs that were included in our evaluation. Solder balls for CBGAs had high melt temperature composition (90Pb/10Sn) and about 0.035 inch diameters...

... the relationship between the solder joint volume and performance. This work provides a guideline on how to determine the soldering process parameters of CBGA assemblies. ceramic packaging ball grid arrays reliability reflow soldering shear strength bending thermal shock fatigue vibrations...

... and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD May 21, 1999. Associate Technical Editor: B. Michel. 21 May 1999 ceramic capacitors ceramic packaging delamination reliability failure analysis acoustic microscopy...

...J. Z. Shi; X. M. Xie; F. Stubhan; J. Freytag A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total...