...Sheng Liu; Wenming Liu; Changyong Lin; Mingxiang Chen A novel ceramic packaging technology by using selective induction heating is presented. Some aspects of this packaging process, including local temperature distribution, hermeticity, tensile strength, and fracture analysis, were tested...

... interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always. Tummala , R. R. , and Rymaszewski , E. J. , 1989 , Microelectronics Packaging Handbook , Van Nostrand Reinhold , New York , pp. 277 – 320 . Verma , K. , Park , S. B. , Han , B. T...

... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received October 24, 2004; revision received May 17, 2004. Review conducted by: C. Basaran. 24 October 2004 17 May 2004 03 06 2005 ceramic packaging strain ageing chip-on-board packaging integrated...

... OF ELECTRONIC PACKAGING . Manuscript received July 2002. Associate Editor: Y. C. Lee. 01 July 2002 30 04 2004 ball grid arrays ceramic packaging assembling soldering thermomechanical treatment real-time systems moire fringes Design and testing of microelectronics devices...

... January 2003 01 November 2003 30 04 2004 multichip modules ceramic packaging heat transfer nozzles convection Recently, the demand for compactness and higher operational speeds has led to high power density in electronic packages. It is well-known that the failure...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...

... into consideration, we explore three ceramic packaging technologies, namely high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate...

... were proposed and investigated by Pang et al. 7 . Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Associate Technical Editor: Yi-Hsin Pao. ceramic packaging ball grid arrays creep finite element analysis...

... of Surface Mount International, Sept. 7–11, pp. 172–177. ball grid arrays chip scale packaging ceramic packaging integrated circuit reliability failure analysis life testing environmental testing integrated circuit testing Weibull distribution thermal stress cracking Reliability...

... on and off at high and low temperature, distortion, and vibration. The best demonstration of the behavior of the assemblies in service is achieved by testing the fatigue life under conditions simulating the above cases. For CBGA, the thermal mismatch between the ceramic package and the PCB causes the solder...

... capacitors ceramic packaging delamination reliability failure analysis acoustic microscopy ultrasonic materials testing flaw detection thermal stress cracking voids (solid) acoustic tomography Ceramic substrates play an extremely important role in electronic packages. Low temperature...

...J. Z. Shi; X. M. Xie; F. Stubhan; J. Freytag A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total...