Skip Nav Destination
1-1 of 1
Keywords: bonding sheetClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041005.
Published Online: November 24, 2010
...Yu-Tang Yen; Te-Hua Fang; Yu-Cheng Lin This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based...