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Keywords: anti-oxidant
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... in the materials and process of ACA interconnect applications were successfully achieved by the anti-oxidant coating layer formation. This finding can accelerate the developments and applications for Cu particles to be used as main conductive fillers in the polymer composite materials for the electronic packaging...