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Keywords: annealing
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
Published Online: September 15, 2021
... test diffusion creep dislocations annealing coarsening surface diffusion oxidation Binghamton University 10.13039/100008451 Task 2878.005 Binghamton University 10.13039/100008451 Task 2878.005 Soldering offers well established benefits in terms of processing...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011007.
Paper No: EP-12-1030
Published Online: March 26, 2013
.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
Published Online: February 11, 2009
... thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu 3 Sn intermetallic compound (IMC) layer, and we observed disintegration of Cu 6 Sn 5 IMC. On the other hand, samples subjected to isothermal annealing exhibited IMC growth...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
...Hong-Seok Min; Young-Chang Joo; Oh-Sung Song We studied cleaning and annealing effects in glass/Si direct bonding using 4 inch Pyrex glass and silicon wafers. SPM cleaning (sulfuric-peroxide mixture, H 2 SO 4 : H 2 O 2 = 4 : 1 , 120 ° C ) , RCA cleaning ( NH 4 OH : H 2 O 2 : H 2 O = 1 : 1 : 5 , 80...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
... 19, 2002. Associate Editor: Y.-H. Pao. 19 March 2002 14 03 2003 copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion crystallisation solidification ageing Plastic BGA Solder Joint Cooling Rate Cu-Sn...