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Keywords: adhesion
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
Published Online: December 8, 2010
... ° C /85% relative humidity chamber. The adhesion strength with different conditions of temperature and humidity was performed using a die shear test. The series of standard reliability tests such as accelerated temperature cycle test, pressure cooker test, thermal humidity storage test, and high...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
Published Online: September 9, 2010
...D. Blass; P. Borgesen The effects of underfill selection on flip chip reliability were always a complex issue. Mechanical optimization of the underfill performance, achieved by the addition of appropriate fillers, is invariably a tradeoff between the adhesion and the coefficient of thermal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 35–40.
Published Online: March 14, 2006
... substrate on the interfacial adhesion, two kinds of MD models were examined in this study. The results revealed that the cuprous oxide content in the copper substrate had a large effect on the interfacial adhesion between the EMC and copper, which is consistent with the experimental observation. Molecular...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... of the Al bond pad. In addition, by comprehension of the effects of the multiple zincation process, the study includes investigating the Al dissolution rate and adhesion strength between eutectic a 37 Pb ∕ 63 Sn solder ball and an under bump metallurgy (UBM) interface. Scanning electron microscopy, energy...
Journal Articles
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
...Liqiang Cao; Zonghe Lai; Johan Liu There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and fine pitch capability are the major advantages of conducting...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
...Mitul Modi; Suresh K. Sitaraman Titanium adhesive layers are commonly used in microelectronic and MEMS applications to help improve the adhesion of other metal layers to a silicon substrate. Such Ti/Si interfaces could potentially delaminate under externally applied mechanical loads, thermally...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 390–397.
Published Online: October 6, 2004
..., Characterization, and Application , Vol. 2, Plenum Press, New York. Somasiri , N. L. D. , Zenner , R. L. D. , and Houge , J. C. , 1991 , “ A Process for Surface Texturing of Kapton Polyimide to Improve Adhesion to Metals ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. , 14 ( 4 ), pp. 798...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
Published Online: April 30, 2004
...M. Y. Tsai; C. H. Hsu; C. N. Han The well-known, closed-form solution to thermal stresses of a die-substrate assembly is initially provided by Suhir in the mid-1980’s after Timoshenko [1] and Chen and Nelson [2] . It has been revised several times in its die attach (adhesive) peel solution by Suhir...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
Published Online: April 30, 2004
.... Inexpensive ceramic-silicone processing (CSP) of superconductor wire and other adhesion substrate coated materials, electronics and various bulk materials resulted in electricity throughput of up to 500 × copper wire throughput at significantly decreased operating voltage and energy losses. All HTS-CSP...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 57–59.
Published Online: April 30, 2004
... soldering process. Furthermore it is important to note that, the bond stress at the toe is not necessarily zero, rather it approaches zero. 1 Perfect adhesive bonding exists at all joint interfaces before the application of thermomechanical loads 11 . 2 The local area of the boundary where...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
Published Online: September 17, 2003
... interface due to high stress concentration and weak adhesion strength. The finite element analyses were implemented to address the stress distribution in the stacked die package and verified by the scanning acoustic microscope. It demonstrated that excellent package integrity could be obtained by applying...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
Published Online: March 14, 2003
...Timothy Ferguson, Mem. ASME; Jianmin Qu, Fellow ASME In a previous study, we found that moisture preconditioning strongly influenced the interfacial fracture toughness of the underfill/solder mask interface, decreasing the interfacial adhesion by approximately one-half for both classifications...
Journal Articles
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
Published Online: December 12, 2002
...Bernd Michel,, Guest Editor, Poly’2000 Co-chair; Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair 12 12 2002 reliability polymers adhesion adhesives plastic packaging integrated circuit packaging fracture mechanics stress effects thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
Published Online: July 26, 2002
...Shoji Kamiya; Hironori Takahashi; Masumi Saka; Hiroyuki Abe´ CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature. Adhesive fracture toughness of these diamond particles...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2002, 124(2): 127–134.
Published Online: May 2, 2002
... the interfacial adhesion. Roughened surfaces generally produce more cohesive failure; therefore, they are used commonly in practice to obtain better adhesion. This paper develops a fracture mechanics model that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
Published Online: July 13, 2000
... at a small proportion (<0.5 wt.%) to a thick film paste enhanced the adhesion between the thick film and the alumina substrate with negligible increase in the electrical resistivity. The use of titanium alloy powder instead of pure titanium powder is preferred. Better composition distribution...