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Keywords: acoustic microscopy
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
... parameters for enhanced system-level thermal performance. Characterization of an interface material between a silicon device and a metal heat spreader can be accomplished via several techniques. In this research, high-magnification radiography with computed tomography, acoustic microscopy, and scanning...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
Published Online: June 3, 2005
.... In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
Published Online: April 30, 2004
... fracture mechanics delamination acoustic microscopy finite element analysis 01 Oct 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Oct. 2003. Associate Editor: Z. Suo...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 84–92.
Published Online: March 14, 2003
...Xia Cai; Liu Chen; Qun Zhang; Bulu Xu; Weidong Huang; Xiaoming Xie; Zhaonian Cheng The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill for two types of flip-chip packages was investigated by conducting thermal cycling test, scanning acoustic microscopy...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
Published Online: May 21, 1999
... have been detected by use of scanning acoustic microscopy (SAM). Defects in buried capacitors caused by thermal shock have also been clearly observed. The results show that SAM can be a powerful analytical tool for the nondestructive evaluation of delaminations in buried passive components. Through...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
..., 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy Die Bonding Isothermal Solidification...