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Keywords: accelerated thermal cycling
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Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
...S. B. Park; Rahul Joshi; Izhar Ahmed; Soonwan Chung Experimental and numerical techniques are employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power cycling (PC) and accelerated thermal cycling (ATC). In PC, nonuniform temperature distribution...
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and <span class="search-highlight">Accelerated</span> <span class="search-highlight">Thermal</span> <span class="search-highlight">Cycling</span>
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and <span class="search-highlight">Accelerated</span> <span class="search-highlight">Thermal</span> <span class="search-highlight">Cycling</span> in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
https://doi.org/10.1115/1.2804091
Published Online: February 13, 2007
...Krishna Tunga; Suresh K. Sitaraman Although accelerated thermal cycling has been widely used in electronics industry to qualify electronic packages, efforts to reduce the time and cost associated with such qualification techniques are continuously being sought. This paper outlines a laser-moiré...
View Article titled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
Open the PDF for An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls in another window
Topics: Ball-Grid-Array packaging, Ceramics, Fatigue life, Solders, Ball-Grid-Array packages, Interferometry, Lasers