.... Fig. 8 AFM image for nanoindentation over IMCs Table 6 Mechanical properties for IMCs IMCs Young's modulus (GPa) Hardness (GPa) Ag 3 Sn 74 ± 3 3.32 ± 0.2 Cu 6 Sn 5 91 ± 5 5.8 ± 0.6 A detailed study was carried out to explore the individual phase...

... loading on mechanical properties of Al–Cu and Cr–Cu interfaces. The mechanical properties are investigated by MD simulations of nanoindentation. Both the results of MD simulations and experiments show the Young’s modulus decrease after thermal cycling, and the Cr–Cu interface is more sensitive...

...). The coefficient of thermal expansion, glass transition temperature ( T g ), Young’s modulus (E), and fracture toughness were revealed by using a thermal mechanical analyzer, a dynamic mechanical analyzer, and a single-edge notch three-point bending test, while moisture absorption study was performed using an 85...

... of underfills were manipulated to represent extremes of practical underfills. The steady-state creep model was incorporated for the eutectic solder bump to represent its real behavior. It was found from the parametric studies that the underfill with high Young’s modulus, low coefficient of thermal expansion...

... Young’s Modulus (GPa) Poisson’s Ratio CTE (ppm/K) Silicon Chip 131 0.3 2.7 Epoxy 1.3 0.4 65 BCB 2.9 0.34 52 Copper 102 0.36 16 FR4 16.8(X,Y), 0.39(XZ,YZ), 14.5(X,Y), 7.4(Z) 0.11(XY) 67.2(Z) LCP 15.8 0.3 5(X,Y), 60(Z) LTCC 150...

... warpage are Young’s modulus, thickness, and coefficient of thermal expansion (CTE). In this paper, an experimental design and statistical methods were used to identify the model structure and parameters that are critical to the warpage of wafers. Bilinear regression models were identified based...

..., 63Sn-37Pb, and 62Sn-36Pb-2Ag solders at the strain rates of 0.001–10.0%/s between temperatures of 313 K and 398 K. Strain rates faster than 2.0%/s were needed to obtain the time-independent Young modulus and yield stress of the solders. Tensile strength increased with increasing strain rates up to 10...

... of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young’s modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE CTE z of the substrate, the thickness of the substrate, and the standoff height. When...

... Interfaces ,” Mater. Res. Soc. Symp. Proc. , 154 , pp. 259 – 265 . Senior Staff Reliability Analyst, Advanced Photonics Technology, Corning, Garden Grove, CA 92841. Young’s modulus can be found as: (3) E = PLl L − l 8 w max I and the maximum bending...