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Keywords: Wirebond
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
Published Online: July 2, 2018
... in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 22, 2017; final manuscript received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
... the next generation of electronics packaging [ 16 , 18 – 20 ]. It is, however, very difficult to comprehend the UB mechanisms because of the short time required for bonding. 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond 09 03 2017 21 09 2017...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
Published Online: July 27, 2017
... Wirebond Driven by the demand for smarter and faster portable electronic products, the advanced semiconductor packaging technology is targeting to integrate multiple and heterogeneous dies or chips. There are many types of three-dimensional (3D) stacking configurations and interconnection...
Topics: Wire, Deflection
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
Published Online: July 14, 2017
... Wirebond From a fundamental jetting principle standpoint, the piston size, nozzle size, and nozzle material are recognized as influential hardware parameters that impact the performance of jetting. To understand the significance of each of the hardware parameters, the research refers back to some...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
Published Online: October 1, 2015
... ACKAGING . Manuscript received September 19, 2014; final manuscript received August 25, 2015; published online October 1, 2015. Assoc. Editor: Jeffrey C. Suhling. 19 09 2014 25 08 2015 BGA Wirebond The semiconductor packaging industry is constantly heading toward small...
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2014, 136(4): 040801.
Paper No: EP-14-1068
Published Online: October 15, 2014
... of this investigation. Also, the state-of-the-art, challenge, and trend of 3D integration will be presented and examined. Furthermore, supply chain readiness for high volume manufacturing (HVM) of TSVs is discussed. 3D packaging Micro vias Microsystems Underfill Wirebond The Electronics Industry has...