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Keywords: Thermoelectric
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
Published Online: June 24, 2013
... online June 24, 2013. Assoc. Editor: Amy Fleischer. 15 01 2013 24 04 2013 Hotspots on a microelectronic package can severely hurt the performance and long-term reliability of the chip. Thermoelectric coolers (TECs) can provide site-specific and on-demand cooling of hot spots...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
Published Online: June 11, 2012
... of thermoelectric coolers (TECs) integrated inside an electronic package has the potential to provide such efficient cooling of hot spots on chip. This paper analyzes the potential of using multiple TECs for hot spot cooling to obtain favorable thermal profile on chip in an energy efficient way. Our computational...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 161–162.
Published Online: March 14, 2003
...Taejin Kim and; D. D. L. Chung The absolute thermoelectric power of tin-lead eutectic solder is − 5 μ V / ° C . The voltage generated by a temperature gradient in solder may affect the performance of microelectronics. Roberts , R. B. , 1985 , “ Absolute Thermopower of Pb, Cu, and Pt...
Topics:
Solders