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Keywords: TIM
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
... circuit board (PCB). To enable electrical isolation, a thermal interface material (TIM) or gap pad is placed between the PCB and HS, resulting in poor heat transfer. Here, we develop an approach to eliminate TIMs and gap pads through modularization of metallic HSs. The use of smaller modular heat sinks...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014
... September 19, 2014. Assoc. Editor: Ashish Gupta. 06 10 2013 18 07 2014 A sensor is developed for simple, in situ characterization of dielectric thermal interface materials (TIMs) at bond line thicknesses less than 100  μ m. The working principle is based on the detection of regions...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031006.
Paper No: EP-13-1006
Published Online: June 24, 2013
... transfer coefficients (HTC) at the heat spreader surface increase steady-state cooling but decrease maximum transient cooling. thermoelectric compact model TIM heat transfer coefficient Effective cooling of microelectronic processors is a crucial area of microelectronics research...