... thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy storage is one of three available ways to store heat, the other...

... properties are considered in the model. Specifically, the loss of solvents in the vehicle system, melting, solidification and further single phase cooling of the solder paste are contemplated in the model. Experiments were conducted with the objective of validating the predictions of the solder paste...

... the same “heating factor”—the integral of the measured temperature above the liquidus (183°C) with respect to dwell time in the reflow profile, but to have different conveyor speeds. Using the theory of heat transmission, it is shown that the solder joint cooling rate during solidification increases...

...Suman Chakraborty; Pradip Dutta, Mem. ASME, In this paper, we develop an analytical heat transfer model, which is capable of analyzing cyclic melting and solidification processes of a phase change material used in the context of electronics cooling systems. The model is essentially based...

... that increasing conveyor speed increases the cooling rate during solder solidification. SEM micrographs reveal that cracks initiated at the acute point near the PCB solder pad, then propagate along the interface of the bulk solder/IMC layer. The test results are ascribed to roughing interface of the bulk solder...

...J. Z. Shi; X. M. Xie; F. Stubhan; J. Freytag A novel two-step process based on isothermal solidification is developed for die attachment of ceramic package. With a simple design of the multilayer system, silicon chip could be bonded onto the allumina substrate in between 200°C and 300°C. The total...