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Keywords: Sn-3.0Ag-0.5Cu
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
... (solid) electromigration Sn-3.0Ag-0.5Cu current crowding interfacial reaction finite element analysis To meet the higher performance and miniaturization requirements for advanced electronic products such as microprocessors, the number of input∕output ports in a silicon chip keeps...
