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Keywords: Sn–0.7Cu solderClose
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
Published Online: August 6, 2021
...Zheng Liu; Li Yang; Yifeng Xiong; Huiming Gao The effect of trace Nb nanoparticles on the thermal properties, wettability, microstructure, and mechanical properties of Sn–0.7Cu solder alloy was investigated. The results showed that the melting temperature of Sn–0.7Cu composite solder alloy...