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Keywords: Shear Cycle Test and
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... layer. 4 The SEM micrographs of the interfacial microstructures for the solder joints reflowed by (a) profile #1, (b) profile #3, (c) profile #5 Figure 5 is the initial crack cross-section SEM image of solder joint caused by shear cycling test. Figure 6 is a typical developed crack...
