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Keywords: Poisson ratio
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Journal Articles

A High Precision Experimental Method to Determine Poisson’s Ratios of Encapsulant Gels

David A. Dillard, Alok Mallick, Donatus C. Ohanehi, Jang-Horng Yu, Didier R. Lefebvre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031006.
https://doi.org/10.1115/1.2957326
Published Online: July 30, 2008
...David A. Dillard; Alok Mallick; Donatus C. Ohanehi; Jang-Horng Yu; Didier R. Lefebvre A high precision technique for measuring Poisson’s ratios of elastomers was experimentally implemented. Test fixtures consisted of hollow metal cylinders fitted with matching pairs of pressure sensors at the top...
View Article titled, A High Precision Experimental Method to Determine <span class="search-highlight">Poisson’s</span> <span class="search-highlight">Ratios</span> of Encapsulant Gels
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Topics: Cylinders, Elastomers, High pressure (Physics), Poisson ratio, Pressure, Casting, Pressure sensors, Deformation, Stress
Journal Articles

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
https://doi.org/10.1115/1.1604156
Published Online: December 15, 2003
... and above the glass transition temperature of the compound) are performed. The tensile creep compliance and the time-dependent Poisson’s ratio of the material at different temperatures are successfully used to construct visco-elastic master curves. As the Poisson’s ratio shows a significant change during...
View Article titled, Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Open the PDF for Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses in another window
Topics: Creep, Molding, Poisson ratio, Stress, Temperature, Relaxation (Physics), Packaging