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Keywords: Plastic BGA
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Journal Articles

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

Y. C. Chan, S. H. Fan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
https://doi.org/10.1115/1.1537070
Published Online: March 14, 2003
... will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion...
View Article titled, The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
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Topics: Cooling, Crystallization, Diffusion (Physics), Intermetallic compounds, Solder joints, Solders, Tin, Temperature, Solidification, Ball-Grid-Array packaging
Journal Articles

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
https://doi.org/10.1115/1.1347997
Published Online: July 14, 1999
.... Ball grid array (BGA) has become the package of choice. Plastic BGA Solder Joint Reliability Cooling Rate Solidification Shear Cycle Test and Fatigue Life plastic packaging ball grid arrays thermal stress cracking reflow soldering integrated circuit reliability scanning...
View Article titled, Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
Open the PDF for Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds in another window
Topics: Conveyor systems, Cooling, Cycles, Fatigue, Shear (Mechanics), Solder joints, Solders, Ball-Grid-Array packaging, Heat transfer, Solidification