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Keywords: Physics of failure
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Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 3, 2017; final manuscript received July 16, 2018; published online August 20, 2018. Assoc. Editor: Jeffrey C. Suhling. 03 05 2017 16 07 2018 Physics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... LECTRONIC P ACKAGING . Manuscript received January 15, 2018; final manuscript received May 9, 2018; published online June 26, 2018. Assoc. Editor: Toru Ikeda. 15 01 2018 09 05 2018 Failure analysis MEMS Microsystems Physics of failure Reliability Sensors...
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020905.
Paper No: EP-17-1083
Published Online: May 9, 2018
... modes and mechanism they considered. However, the fatigue strength exponent they used is material dependent. The exponent is very conservative (i.e., leads to longer test time/test level) as compared to the physics-of-failure-based strain-cycles model for lead free solder joints, explained earlier (4...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... to Bi to address some of these shortcomings. Cu is expected to enhance thermal properties of the resultant alloy and Sb is expected to increase the reaction with Cu and Ni metallization. Composite materials DCA Electronic Failure analysis Harsh environment Physics of failure Power...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010903.
Paper No: EP-17-1090
Published Online: March 2, 2018
...) Virtual techniques: Schemes of validated simulations allow capturing the physics of failure (PoF) proactively in the design for reliability (DfR) process; and (iii) Prognostics health management (PHM). A new concept is introduced for adding a minimum of PHM features at various levels of automotive...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
Published Online: October 5, 2017
...-Shao Lai. 25 07 2017 19 09 2017 Displays Physics of failure Reliability Edge-lit light guides are a common source of illumination for LCD displays in televisions, monitors, and laptop or tablet computers. A polymeric light diffusing plate is illuminated at its edges...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041003.
Paper No: EP-17-1033
Published Online: August 25, 2017
.... Assoc. Editor: Eric Wong. 22 03 2017 04 06 2017 Physics of failure Reliability Thin films deposited on substrates are used in a wide range of applications, including microelectronics, in which they are commonly stacked and patterned. For microelectronic packaging...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 18, 2016; final manuscript received January 3, 2017; published online June 14, 2017. Assoc. Editor: Toru Ikeda. 18 05 2016 03 01 2017 Failure analysis Harsh environment Microsystems Physics of failure Reliability SMT...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
Published Online: June 12, 2017
... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Traditionally, CPI phenomena caused by high peeling and shear stresses (hundreds of MPa) resulted in a variety of yield...
Journal Articles
Journal Articles
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010802.
Paper No: EP-16-1107
Published Online: January 16, 2017
... networks. Physics of failure Plastic Electronics Reliability 17 09 2016 19 12 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 17, 2016; final manuscript...
Journal Articles
Journal Articles
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040802.
Paper No: EP-15-1068
Published Online: September 25, 2015
.... Editor: Mehdi Asheghi. 22 07 2015 30 08 2015 3D packaging Chip stacking Failure analysis Physics of failure Thermal analysis Three-dimensional interconnect technology promises significant performance advantages for the next generation of computing and communications...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011009.
Paper No: EP-14-1062
Published Online: October 15, 2014
... than the principal directions of the structure was examined. This method was found to have significant limitations, but showed better agreement with simultaneous multiaxial vibration experiments. Failure analysis Harsh environment Physics of failure Reliability Fig. 14 Single-axis...
Journal Articles